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t2g4003532-fl 30w, 32v dc ? 3.5 ghz, gan rf power transistor datasheet: rev - 12-30-13 - 1 of 13 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com applications ? military radar ? civilian radar ? professional and military radio communications ? test instrumentation ? wideband or narrowband amplifiers ? jammers ordering information part eccn description t2g4003532-fl ear99 packaged part flangeless t2g4003532- fs/fl-evb1 ear99 2.7-3.5 ghz evaluation board product features ? frequency: dc to 3.5 ghz ? output power (p 3db ): 28 w at 3.5 ghz ? linear gain: >16 db at 3.5 ghz ? operating voltage: 32 v ? low thermal resistance package functional block diagram pin configuration pin no. label 1 v d / rf out 2 v g / rf in flange source general description the triquint t2g4003532-fl is a 30 w (p 3db ) discrete gan on sic hemt which operates from dc to 3.5 ghz. the device is constructed with triquint?s proven tqgan25 process, which features advanced field plate techniques to optimize power and efficiency at high drain bias operating conditions. this optimization can potentially lower system costs in terms of fewer am plifier line-ups and lower thermal management costs. lead-free and rohs compliant evaluation boards are available upon request.
t2g4003532-fl 30w, 32v dc ? 3.5 ghz, gan rf power transistor datasheet: rev - 12-30-13 - 2 of 13 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com absolute maximum ratings parameter value breakdown voltage (bv dg ) 100 v gate voltage range (v g ) -7 to 0 v drain current (i d ) 4.5 a gate current (i g ) -7.5 to 12 ma power dissipation (p d ) 40 w rf input power, cw, t = 25c (p in ) 38.75 dbm channel temperature (t ch ) 275 c mounting temperature (30 seconds) 320 c storage temperature -40 to 150 c operation of this device outside the parameter rang es given above may cause permanent damage. these are stress ratings only, and functional operation of th e device at these conditions is not implied. recommended operating conditions parameter value drain voltage (v d ) 32 v (typ.) drain quiescent current (i dq ) 150 ma (typ.) peak drain current ( i d ) 1900 ma (typ.) gate voltage (v g ) -2.9 v (typ.) channel temperature (t ch ) 225 c (max) power dissipation, cw (p d ) 28 w (max) power dissipation, pulse (p d ) 46 w (max) electrical specifications are measured at specified test conditions. specifications are not guaranteed over all recommen ded operating conditions. rf characterization ? load pull performance at 3.5 ghz (1) test conditions unless otherwise noted: t a = 25 c, v d = 32 v, i dq = 150 ma symbol parameter min typical max units g lin linear gain 17.7 db p 3db output power at 3 db gain compression 31.0 w de 3db drain efficiency at 3 db gain compression 59.7 % pae 3db power-added efficiency at 3 db gain compression 57.6 % g 3db gain at 3 db compression 14.7 db notes: 1. v ds = 32 v, i dq = 150 ma; pulse: 100s, 20% rf characterization ? load pull performance at 1.0 ghz (1) test conditions unless otherwise noted: t a = 25 c, v d = 32 v, i dq = 150 ma symbol parameter min typical max units g lin linear gain 21.6 db p 3db output power at 3 db gain compression 27.0 w de 3db drain efficiency at 3 db gain compression 51.0 % pae 3db power-added efficiency at 3 db gain compression 50.0 % g 3db gain at 3 db compression 18.6 db notes: 1. v ds = 32 v, i dq = 150 ma; pulse: 100s, 20%
t2g4003532-fl 30w, 32v dc ? 3.5 ghz, gan rf power transistor datasheet: rev - 12-30-13 - 3 of 13 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com rf characterization ? performance at 3.5 ghz (1, 2) test conditions unless otherwise noted: t a = 25 c, v d = 32 v, i dq = 150 ma symbol parameter min typical max units g lin linear gain 16.0 16.5 db p 3db output power at 3 db gain compression 25.0 28.0 w de 3db drain efficiency at 3 db gain compression 45.5 48.8 % g 3db gain at 3 db compression 13.0 13.5 db notes: 1. performance at 3.5 ghz in the 2.7 to 3.5 ghz eva luation board 2. v ds = 32 v, i dq = 150 ma; pulse: 100s, 20% rf characterization ? narrow band performance at 3. 50 ghz (1) test conditions unless otherwise noted: t a = 25 c, v d = 32 v, i dq = 150 ma symbol parameter typical vswr impedance mismatch ruggedness 10:1 notes: 1. v ds = 32 v, i dq = 150 ma, cw at p 1db
t2g4003532-fl 30w, 32v dc ? 3.5 ghz, gan rf power transistor datasheet: rev - 12-30-13 - 4 of 13 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com thermal and reliability information parameter test conditions value units thermal resistance ( jc ) dc at 85 c case 4.9 oc/w channel temperature (t ch ) 225 c notes: thermal resistance measured to bottom of package, c w. median lifetime maximum channel temperature t base = 85c, p d = 30 w
t2g4003532-fl 30w, 32v dc ? 3.5 ghz, gan rf power transistor datasheet: rev - 12-30-13 - 5 of 13 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com load pull smith charts (1, 2) rf performance that the device typically exhibits when placed in the specified impedance env ironment. the impedances are not the impedances of the device, they are the impedanc es presented to the device via an rf circuit or loa d- pull system. the impedances listed follow an optimized trajectory to maintain high power and high efficiency. notes: 1. test conditions: v ds = 32 v, i dq = 150 ma 2. test signal: pulse width = 100 sec, duty cycle = 20%
t2g4003532-fl 30w, 32v dc ? 3.5 ghz, gan rf power transistor datasheet: rev - 12-30-13 - 6 of 13 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com typical performance performance is based on compromised impedance point and measured at dut reference plane. 32 34 36 38 40 42 44 46 10 12 14 16 18 20 22 24 26 32 34 36 38 40 42 44 46 0 10 20 30 40 50 60 70 80 32 34 36 38 40 42 44 46 0 10 20 30 40 50 60 70 80 pout [dbm] gain [db] dreff. & pae [%] t2g4003532-fl gain dreff. and pae vs. pout 1000 mhz, 100 usec 20%, vds = 32v, idq = 150 ma gain dreff. pae z s = 1.96 + j3.03 z l = 15.32 - j4.87 32 34 36 38 40 42 44 46 10 12 14 16 18 20 22 24 26 32 34 36 38 40 42 44 46 0 10 20 30 40 50 60 70 80 32 34 36 38 40 42 44 46 0 10 20 30 40 50 60 70 80 pout [dbm] gain [db] dreff. & pae [%] t2g4003532-fl gain dreff. and pae vs. pout 2000 mhz, 100 usec 20%, vds = 32v, idq = 150 ma gain dreff. pae z s = 4.23 - j2.49 z l = 8.61 + j3.85 32 34 36 38 40 42 44 46 10 12 14 16 18 20 22 24 26 32 34 36 38 40 42 44 46 0 10 20 30 40 50 60 70 80 32 34 36 38 40 42 44 46 0 10 20 30 40 50 60 70 80 pout [dbm] gain [db] dreff. & pae [%] t2g4003532-fl gain dreff. and pae vs. pout 3000 mhz, 100 usec 20%, vds = 32v, idq = 150 ma gain dreff. pae z s = 15.13 - j9.33 z l = 7.13 + j2.82 32 34 36 38 40 42 44 46 10 12 14 16 18 20 22 24 26 32 34 36 38 40 42 44 46 0 10 20 30 40 50 60 70 80 32 34 36 38 40 42 44 46 0 10 20 30 40 50 60 70 80 pout [dbm] gain [db] dreff. & pae [%] t2g4003532-fl gain dreff. and pae vs. pout 3500 mhz, 100 usec 20%, vds = 32v, idq = 150 ma gain dreff. pae z s = 6.05 + j1.70 z l = 7.64 + j2.88
t2g4003532-fl 30w, 32v dc ? 3.5 ghz, gan rf power transistor datasheet: rev - 12-30-13 - 7 of 13 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com performance over temperature (1, 2) performance measured in triquint?s 2.7 ghz to 3.5 g hz evaluation board at 3 db compression. notes: 1. test conditions: v ds = 32 v, i dq = 150 ma 2. test signal: pulse width = 100 s, duty cycle = 20%
t2g4003532-fl 30w, 32v dc ? 3.5 ghz, gan rf power transistor datasheet: rev - 12-30-13 - 8 of 13 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com evaluation board performance (1, 2) performance at 3 db compression notes: 1. test conditions: v ds = 32 v, i dq = 150 ma 2. test signal: pulse width = 100 s, duty cycle = 20 % application circuit bias-down procedure turn off rf signal turn off v d and wait 1 second to allow drain capacitor dissipation turn off v g bias-up procedure set gate voltage (v g ) to -5.0v set drain voltage (v d ) to 32 v slowly increase v g until quiescent i d is 150 ma. apply rf signal
t2g4003532-fl 30w, 32v dc ? 3.5 ghz, gan rf power transistor datasheet: rev - 12-30-13 - 9 of 13 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com evaluation board layout top rf layer is 0.020? thick rogers ro4350b, ? r = 3.48. the pad pattern shown has been developed a nd tested for optimized assembly at triquint semiconductor. the pcb land pa ttern has been developed to accommodate lead and pa ckage tolerances. bill of materials reference des. value qty manufacturer part number c1, c2, c3, c14 10 pf 4 atc 600s100ft250xt c6, c12 0.1 uf 2 kemet c1206c104k1ractu c7, c13 1.0 uf 2 avx 18121c105kat2a c8 22 uf 1 vishay sprague 293d226x9035e2te3 c15 470 uf 1 illinois capacitor 477kxm035m c16 2400 pf 1 dielectric labs c08bl242x_5sn_x0t l1, l2 8.0 nh 2 coilcraft a03tjlb r1 12.1 ohms 1 vishay dale crcw120612r1fkea r2 1000 ohms 1 vishay dale crcw12061k00fkea r3 97.6 ohms 1 vishay dale crcw060397r6fkea
t2g4003532-fl 30w, 32v dc ? 3.5 ghz, gan rf power transistor datasheet: rev - 12-30-13 - 10 of 13 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com pin layout note: the t2g4003532-fl will be marked with the ?3532fs2? designator and a lot code marked below the part de signator. the ?yy? represents the last two digits of the calendar year the part was manufactured, the ?ww? is the work we ek of the assembly lot start, the ?mxxx? is the production lot number, and the ?zzz? is an auto-generated serial number. pin description pin symbol description 1 v d / rf out drain voltage / rf output matched to 50 ohms; see e vb layout on page 9 as an example. 2 v g / rf in gate voltage / rf input matched to 50 ohms; see evb layout on page 9 as an example. 3 flange source connected to ground; see evb layout on page 9 as an example.
t2g4003532-fl 30w, 32v dc ? 3.5 ghz, gan rf power transistor datasheet: rev - 12-30-13 - 11 of 13 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com mechanical information all dimensions are in millimeters. note: this package is lead-free/rohs-compliant. the plati ng material on the leads is niau. it is compatible with both lead-free (maximum 260 c reflow temperature) and tin-lead (m aximum 245c reflow temperature) soldering processe s.
t2g4003532-fl 30w, 32v dc ? 3.5 ghz, gan rf power transistor datasheet: rev - 12-30-13 - 12 of 13 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com product compliance information esd sensitivity ratings caution! esd-sensitive device esd rating: class 1b value: passes 500 v to < 1000 v max. test: human body model (hbm) standard: jedec standard jesd22-a114 solderability compatible with the latest version of j-std- 020, lead free solder, 260 c rohs compliance this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazar dous substances in electrical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimony free ? tbbp-a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free msl rating level 3 at +260 c convection reflow the part is rated moisture sensitivity level 3 at 260c per jedec standard ipc/jedec j-std-020. eccn us department of commerce ear99 recommended soldering temperature profile
t2g4003532-fl 30w, 32v dc ? 3.5 ghz, gan rf power transistor datasheet: rev - 12-30-13 - 13 of 13 - disclaimer: subject to change without notice ? 2013 triquint www.triquint.com contact information for the latest specifications, additional product i nformation, worldwide sales and distribution locati ons, and information about triquint: web: www.triquint.com tel: +1.972.994.8465 email: info-sales@triquint.com fax: +1.972.994.8504 for technical questions and application information : email: info-products@triquint.com important notice the information contained herein is believed to be reliable. triquint makes no warranties regarding the informat ion contained herein. triquint assumes no responsibility or liability wha tsoever for any of the information contained herein. triquint assumes no responsibility or liab ility whatsoever for the use of the information con tained herein. the information contained herein is provid ed "as is, where is" and with all faults, and the e ntire risk associated with such information is entirely with the user. all information contained herein is subject to chan ge without notice. customers should obtain and verify the latest relev ant informa tion before placing orders for triquint products. the information contained herein or any use of such inf ormation does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with r egard to such information itself or anything described by such information. triquint products are not warranted or authorized f or use as critical components in medical, life-savi ng, or life- sustaining applications, or other applications wher e a failure w ould reasonably be expected to cause severe persona l injury or death.

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